DESCRIPTION :- *Measure the warping of a part or board due to heat. *A laser on the underside measures the displacement in both X and Y-axis directions. *19-point configuration and selectable temperature setting allow for the measurement of warping trends. *Dedicated software analyzes the displacement measurement data. *Optional video monitoring system enables you to observe and record the melting process of the solder. SPECIFICATION:- Size :650 (W) x 400 (D) x 425 (H) mm Sample size :Max 70 mm x 70 mm Measurement range :Max 70 mm (Y-axis) 0~3 mm (height direction) Table travel speed:Max 40 mm/s Table resolution :Smallest 10 µm Illuminant :Semiconductor Laser 670 nm class 2 Spot diameter:Approx. 70 µm Resolution :Smallest 0.2 µm CONDITION : USED TESTED, RUNNING CONDITION ( PRICE AS PER FOB PRICE ) ( PRICE IS NEGOTIABLE )